JPH034438Y2 - - Google Patents

Info

Publication number
JPH034438Y2
JPH034438Y2 JP10278888U JP10278888U JPH034438Y2 JP H034438 Y2 JPH034438 Y2 JP H034438Y2 JP 10278888 U JP10278888 U JP 10278888U JP 10278888 U JP10278888 U JP 10278888U JP H034438 Y2 JPH034438 Y2 JP H034438Y2
Authority
JP
Japan
Prior art keywords
solder
jet
nozzle
floating body
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10278888U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228367U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10278888U priority Critical patent/JPH034438Y2/ja
Publication of JPH0228367U publication Critical patent/JPH0228367U/ja
Application granted granted Critical
Publication of JPH034438Y2 publication Critical patent/JPH034438Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP10278888U 1988-08-04 1988-08-04 Expired JPH034438Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10278888U JPH034438Y2 (en]) 1988-08-04 1988-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10278888U JPH034438Y2 (en]) 1988-08-04 1988-08-04

Publications (2)

Publication Number Publication Date
JPH0228367U JPH0228367U (en]) 1990-02-23
JPH034438Y2 true JPH034438Y2 (en]) 1991-02-05

Family

ID=31333019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10278888U Expired JPH034438Y2 (en]) 1988-08-04 1988-08-04

Country Status (1)

Country Link
JP (1) JPH034438Y2 (en])

Also Published As

Publication number Publication date
JPH0228367U (en]) 1990-02-23

Similar Documents

Publication Publication Date Title
JPS63169793A (ja) プリント基板へのチツプ部品の取付構造
JP2000040872A (ja) プリント基板のはんだ付け方法および噴流はんだ槽
JPH034438Y2 (en])
JPH0144220Y2 (en])
JPH0421647Y2 (en])
CN217591209U (zh) 一种用于固定贴片器件的承载电路板及电器组件
JP3956250B2 (ja) 噴流はんだ槽
JPH08181424A (ja) プリント基板及びその半田付け方法
JPH0621629A (ja) プリント配線板のパッド
TW540278B (en) Method for welding printed circuit board and jet solder tank
JP3197856B2 (ja) 噴流はんだ槽
JPS6214497A (ja) 印刷配線板の製造方法
JPH0530849Y2 (en])
JP2665343B2 (ja) 印刷回路板の洗浄方法
JPS6343193B2 (en])
KR100511167B1 (ko) 분류 땜납조
JP2002217502A (ja) プリント基板の取付部構造及びその製造方法
JPH0287559U (en])
JPH0225578Y2 (en])
JPH0222146Y2 (en])
JPH0489176A (ja) ハンダ噴流ノズル
JPS6117356A (ja) はんだ付け装置
JPH0215316Y2 (en])
JP2000079466A (ja) 噴流はんだ槽
JPH02294055A (ja) Icパッケージ